Showing posts with label Intel® Core™2 Extreme Desktop Processor. Show all posts

Showing posts with label Intel® Core™2 Extreme Desktop Processor. Show all posts

Tuesday, March 1, 2011

Intel® Core™2 Extreme Processor QX9775

(12M Cache, 3.20 GHz, 1600 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	QX9775
# of Cores	4
# of Threads	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus/Core Ratio	8
FSB Speed	1600 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	150 W
VID Voltage Range	0.850V-1.3500V

Package Specifications
T_CASE	63°C
Package Size	37.5mm x 37.5mm
Processing Die Size	214 mm²
# of Processing Die Transistors	820 million
Sockets Supported	LGA771
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Extreme Processor QX9770

(12M Cache, 3.20 GHz, 1600 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	QX9770
# of Cores	4
# of Threads	4
Clock Speed	3.2 GHz
L2 Cache	12 MB
Bus/Core Ratio	8
FSB Speed	1600 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	136 W
VID Voltage Range	0.8500V-1.3625V

Package Specifications
T_CASE	55.5°C
Package Size	37.5mm x 37.5mm
Processing Die Size	214 mm²
# of Processing Die Transistors	820 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Extreme Processor QX9650

(12M Cache, 3.00 GHz, 1333 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q4'07
Processor Number	QX9650
# of Cores	4
# of Threads	4
Clock Speed	3 GHz
L2 Cache	12 MB
Bus/Core Ratio	9
FSB Speed	1333 MHz
FSB Parity	Yes
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	130 W
VID Voltage Range	0.8500V-1.3625V

Package Specifications
T_CASE	64.5°C
Package Size	37.5mm x 37.5mm
Processing Die Size	214 mm²
# of Processing Die Transistors	820 million
Sockets Supported	LGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source : Intel.com

Intel® Core™2 Extreme Processor X6800

(4M Cache, 2.93 GHz, 1066 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'06
Processor Number	X6800
# of Cores	2
# of Threads	2
Clock Speed	2.93 GHz
L2 Cache	4 MB
Bus/Core Ratio	11
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	75 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
T_CASE	60.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm²
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Extreme Processor QX6850

(8M Cache, 3.00 GHz, 1333 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'07
Processor Number	QX6850
# of Cores	4
# of Threads	4
Clock Speed	3 GHz
L2 Cache	8 MB
Bus/Core Ratio	9
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	130 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
T_CASE	64.5°C
Processing Die Size	286 mm²
# of Processing Die Transistors	582 million
Sockets Supported	LGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source; Intel.com

Intel® Core™2 Extreme Processor QX6800

(8M Cache, 2.93 GHz, 1066 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q2'07
Processor Number	QX6800
# of Cores	4
# of Threads	4
Clock Speed	2.93 GHz
L2 Cache	8 MB
Bus/Core Ratio	11
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	130 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
T_CASE	64.5°C
Package Size	37.5mm x 37.5mm
Processing Die Size	286 mm²
# of Processing Die Transistors	582 million
Sockets Supported	LGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source : Intel.com

Intel® Core™2 Extreme Processor QX6700

(8M Cache, 2.66 GHz, 1066 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q4'06
Processor Number	QX6700
# of Cores	4
# of Threads	4
Clock Speed	2.66 GHz
L2 Cache	8 MB
Bus/Core Ratio	10
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	130 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
T_CASE	64.5°C
Package Size	37.5mm x 37.5mm
Processing Die Size	286 mm²
# of Processing Die Transistors	582 million
Sockets Supported	LGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Inte.com

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