(8M Cache, 3.00 GHz, 1333 MHz FSB)
SPECIFICATIONS
| Essentials | |
Status | Launched |
Launch Date | Q3'07 |
Processor Number | QX6850 |
# of Cores | 4 |
# of Threads | 4 |
Clock Speed | 3 GHz |
L2 Cache | 8 MB |
Bus/Core Ratio | 9 |
FSB Speed | 1333 MHz |
FSB Parity | No |
Instruction Set | 64-bit |
Embedded Options Available | No |
Supplemental SKU | No |
Lithography | 65 nm |
Max TDP | 130 W |
VID Voltage Range | 0.8500V-1.5V |
| Package Specifications | |
TCASE | 64.5°C |
Processing Die Size | 286 mm2 |
# of Processing Die Transistors | 582 million |
Sockets Supported | LGA775 |
Halogen Free Options Available | No |
| Advanced Technologies | |
Intel® Turbo Boost Technology | No |
Intel® Hyper-Threading Technology | No |
Intel® Virtualization Technology (VT-x) | Yes |
Intel® Trusted Execution Technology | No |
AES New Instructions | No |
Intel® 64 | Yes |
Idle States | Yes |
Enhanced Intel SpeedStep® Technology | Yes |
Intel® Demand Based Switching | No |
Thermal Monitoring Technologies | Yes |
Execute Disable Bit | Yes |
Source; Intel.com
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