Apple MacBook Air MC503LL/A Laptop

Specifications

• 13.3-inch LED-backlit glossy widescreen display with a 1440 x 900-pixel resolution
• Up to 7 hours of wireless productivity plus up to 30 days of standby time
• 1.86 GHz Intel Core 2 Duo processor with 6 MB on-chip shared L2 cache and 1066 MHz frontside bus.
• 128 GB flash memory storage
• 2 GB installed RAM (1066 MHz DDR3; supports up to 4 GB)
• NVIDIA GeForce 320M graphics processor (with 256 MB of DDR3 SDRAM shared with main memory) for an outstanding everyday graphics experience.
• Built-in FaceTime camera for video chatting
• Wi-Fi wireless networking (based on 802.11n specification; 802.11a/b/g compatible)
• Bluetooth 2.1 + EDR (Enhanced Data Rate) for connecting with peripherals such as keyboards, mice and cell phones
• Two USB 2.0 ports with networking using optional Apple USB Ethernet adapter
• SD card slot
• Mini DisplayPort output port with support for DVI, VGA, dual-link DVI, and HDMI (requires adapters, sold separately) 

Intel® Core™2 Duo Processor E8500

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	E8500
# of Cores	2
# of Threads	2
Clock Speed	3.16 GHz
L2 Cache	6 MB
Bus/Core Ratio	9.5
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V
Tray 1ku Budgetary Price	$183.00

Package Specifications
TCASE	72.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	107 mm2
# of Processing Die Transistors	410 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E8600

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'08
Processor Number	E8600
# of Cores	2
# of Threads	2
Clock Speed	3.33 GHz
L2 Cache	6 MB
Bus/Core Ratio	10
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V
Tray 1ku Budgetary Price	$266.00

Package Specifications
TCASE	72.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	107 mm2
# of Processing Die Transistors	410 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E8400

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	E8400
# of Cores	2
# of Threads	2
Clock Speed	3 GHz
L2 Cache	6 MB
Bus/Core Ratio	9
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	Yes
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V
Tray 1ku Budgetary Price	$163.00

Package Specifications
TCASE	72.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	107 mm2
# of Processing Die Transistors	410 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E8300

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q2'08
Processor Number	E8300
# of Cores	2
# of Threads	2
Clock Speed	2.83 GHz
L2 Cache	6 MB
Bus/Core Ratio	8.5
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V

Package Specifications
TCASE	72.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	107 mm2
# of Processing Die Transistors	410 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Virtualization Technology for Directed I/O (VT-d)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E8200

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	E8200
# of Cores	2
# of Threads	2
Clock Speed	2.66 GHz
L2 Cache	6 MB
Bus/Core Ratio	8
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V

Package Specifications
TCASE	72.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	107 mm2
# of Processing Die Transistors	410 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E8190

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	E8190
# of Cores	2
# of Threads	2
Clock Speed	2.66 GHz
L2 Cache	6 MB
Bus/Core Ratio	8
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V

Package Specifications
TCASE	72.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	107 mm2
# of Processing Die Transistors	410 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	No
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E7600

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q2'09
Processor Number	E7600
# of Cores	2
# of Threads	2
Clock Speed	3.06 GHz
L2 Cache	3 MB
Bus/Core Ratio	11.5
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V
Tray 1ku Budgetary Price	$133.00

Package Specifications
TCASE	74.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	82 mm2
# of Processing Die Transistors	228 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E7500

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'09
Processor Number	E7500
# of Cores	2
# of Threads	2
Clock Speed	2.93 GHz
L2 Cache	3 MB
Bus/Core Ratio	11
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-V1.3625
Tray 1ku Budgetary Price	$113.00

Package Specifications
TCASE	74.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	82 mm2
# of Processing Die Transistors	228 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	See SPEC Details
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E7400

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q1'08
Processor Number	E7400
# of Cores	2
# of Threads	2
Clock Speed	2.8 GHz
L2 Cache	3 MB
Bus/Core Ratio	10.5
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	Yes
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V
Tray 1ku Budgetary Price	$113.00

Package Specifications
TCASE	74.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	82 mm2
# of Processing Die Transistors	228 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	See SPEC Details
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E7300

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'08
Processor Number	E7300
# of Cores	2
# of Threads	2
Clock Speed	2.66 GHz
L2 Cache	3 MB
Bus/Core Ratio	10
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	45 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.3625V
Tray 1ku Budgetary Price	$113.00

Package Specifications
TCASE	74.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	82 mm2
# of Processing Die Transistors	228 million
Sockets Supported	LGA775
Halogen Free Options Available	Yes

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	No
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com