Intel® Core™2 Extreme Processor X6800

(4M Cache, 2.93 GHz, 1066 MHz FSB)

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'06
Processor Number	X6800
# of Cores	2
# of Threads	2
Clock Speed	2.93 GHz
L2 Cache	4 MB
Bus/Core Ratio	11
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	75 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
TCASE	60.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6850

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'07
Processor Number	E6850
# of Cores	2
# of Threads	2
Clock Speed	3 GHz
L2 Cache	4 MB
Bus/Core Ratio	9
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V
Tray 1ku Budgetary Price	$183.00

Package Specifications
TCASE	72°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6750

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'07
Processor Number	E6750
# of Cores	2
# of Threads	2
Clock Speed	2.66 GHz
L2 Cache	4 MB
Bus/Core Ratio	8
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V
Tray 1ku Budgetary Price	$183.00

Package Specifications
TCASE	72°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6700

PECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'06
Processor Number	E6700
# of Cores	2
# of Threads	2
Clock Speed	2.66 GHz
L2 Cache	4 MB
Bus/Core Ratio	10
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
TCASE	60.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6600

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'06
Processor Number	E6600
# of Cores	2
# of Threads	2
Clock Speed	2.4 GHz
L2 Cache	4 MB
Bus/Core Ratio	9
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V
Tray 1ku Budgetary Price	$224.00

Package Specifications
TCASE	60.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source : Intel.com

Intel® Core™2 Duo Processor E6550

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'07
Processor Number	E6550
# of Cores	2
# of Threads	2
Clock Speed	2.33 GHz
L2 Cache	4 MB
Bus/Core Ratio	7
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
TCASE	72°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	Yes
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6540

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'07
Processor Number	E6540
# of Cores	2
# of Threads	2
Clock Speed	2.33 GHz
L2 Cache	4 MB
Bus/Core Ratio	7
FSB Speed	1333 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
TCASE	72°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6420

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q2'07
Processor Number	E6420
# of Cores	2
# of Threads	2
Clock Speed	2.13 GHz
L2 Cache	4 MB
Bus/Core Ratio	8
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
TCASE	60.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6400

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q3'06
Processor Number	E6400
# of Cores	2
# of Threads	2
Clock Speed	2.13 GHz
L2 Cache	2 MB
Bus/Core Ratio	8
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	Yes
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V
Tray 1ku Budgetary Price	$179.00

Package Specifications
TCASE	61.4°C
Package Size	37.5mm x 37.5mm
Processing Die Size	111 mm2
# of Processing Die Transistors	167 million
Sockets Supported	LGA775, PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: Intel.com

Intel® Core™2 Duo Processor E6320

SPECIFICATIONS

Essentials
Status	Launched
Launch Date	Q2'07
Processor Number	E6320
# of Cores	2
# of Threads	2
Clock Speed	1.86 GHz
L2 Cache	4 MB
Bus/Core Ratio	7
FSB Speed	1066 MHz
FSB Parity	No
Instruction Set	64-bit
Embedded Options Available	No
Supplemental SKU	No
Lithography	65 nm
Max TDP	65 W
VID Voltage Range	0.8500V-1.5V

Package Specifications
TCASE	60.1°C
Package Size	37.5mm x 37.5mm
Processing Die Size	143 mm2
# of Processing Die Transistors	291 million
Sockets Supported	PLGA775
Halogen Free Options Available	No

Advanced Technologies
Intel® Turbo Boost Technology	No
Intel® Hyper-Threading Technology	No
Intel® Virtualization Technology (VT-x)	Yes
Intel® Trusted Execution Technology	No
AES New Instructions	No
Intel® 64	Yes
Idle States	Yes
Enhanced Intel SpeedStep® Technology	Yes
Intel® Demand Based Switching	No
Thermal Monitoring Technologies	Yes
Execute Disable Bit	Yes

Source: intel.com