SPECIFICATIONS
Essentials | |
Status | EOIS |
Launch Date | Q4'05 |
Processor Number | 630 |
# of Cores | 1 |
# of Threads | 2 |
Clock Speed | 3 GHz |
L2 Cache | 2 MB |
Bus/Core Ratio | 15 |
FSB Speed | 800 MHz |
FSB Parity | No |
Instruction Set | 64-bit |
Embedded Options Available | No |
Supplemental SKU | No |
Lithography | 90 nm |
Max TDP | 84 W |
VID Voltage Range | 1.200V-1.400V |
Package Specifications | |
TCASE | 66.6°C |
Package Size | 37.5mm x 37.5mm |
Processing Die Size | 135 mm2 |
# of Processing Die Transistors | 169 million |
Sockets Supported | PLGA775 |
Halogen Free Options Available | No |
Advanced Technologies | |
Intel® Turbo Boost Technology | No |
Intel® Hyper-Threading Technology | Yes |
Intel® Virtualization Technology (VT-x) | No |
Intel® Trusted Execution Technology | No |
Intel® 64 | Yes |
Idle States | No |
Enhanced Intel SpeedStep® Technology | Yes |
Intel® Demand Based Switching | No |
Execute Disable Bit | Yes |
source: intel.com
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