SPECIFICATIONS
Essentials | |
Status | Launched |
Launch Date | Q2'07 |
Processor Number | 430 |
# of Cores | 1 |
# of Threads | 1 |
Clock Speed | 1.8 GHz |
L2 Cache | 512 KB |
Bus/Core Ratio | 9.0 |
FSB Speed | 800 MHz |
FSB Parity | No |
Instruction Set | 64-bit |
Embedded Options Available | No |
Supplemental SKU | No |
Lithography | 65 nm |
Max TDP | 35 W |
VID Voltage Range | 1.00V-1.3375V |
Tray 1ku Budgetary Price | $34.00 |
Package Specifications | |
TCASE | 60.4°C |
Package Size | 37.5mm x 37.5mm |
Processing Die Size | 77 mm2 |
# of Processing Die Transistors | 105 million |
Sockets Supported | LGA775 |
Halogen Free Options Available | No |
Advanced Technologies | |
Intel® Turbo Boost Technology | No |
Intel® Hyper-Threading Technology | No |
Intel® Virtualization Technology (VT-x) | No |
Intel® Virtualization Technology for Directed I/O (VT-d) | No |
Intel® Trusted Execution Technology | No |
AES New Instructions | No |
Intel® 64 | Yes |
Idle States | No |
Enhanced Intel SpeedStep® Technology | No |
Intel® Demand Based Switching | No |
Thermal Monitoring Technologies | Yes |
Execute Disable Bit | Yes |
source : intel.com
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