SPECIFICATIONS
| Essentials | |
Status | Launched |
Launch Date | Q3'08 |
Processor Number | Q9650 |
# of Cores | 4 |
# of Threads | 4 |
Clock Speed | 3 GHz |
L2 Cache | 12 MB |
Bus/Core Ratio | 9 |
FSB Speed | 1333 MHz |
FSB Parity | No |
Instruction Set | 64-bit |
Embedded Options Available | No |
Supplemental SKU | No |
Lithography | 45 nm |
Max TDP | 95 W |
VID Voltage Range | 0.8500V-1.3625V |
Tray 1ku Budgetary Price | $316.00 |
| Package Specifications | |
TCASE | 71.4°C |
Package Size | 37.5mm x 37.5mm |
Processing Die Size | 214 mm2 |
# of Processing Die Transistors | 820 million |
Sockets Supported | LGA775 |
Halogen Free Options Available | Yes |
| Advanced Technologies | |
Intel® Turbo Boost Technology | No |
Intel® Hyper-Threading Technology | No |
Intel® Virtualization Technology (VT-x) | Yes |
Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel® Trusted Execution Technology | Yes |
AES New Instructions | No |
Intel® 64 | Yes |
Idle States | Yes |
Enhanced Intel SpeedStep® Technology | Yes |
Intel® Demand Based Switching | No |
Thermal Monitoring Technologies | Yes |
Execute Disable Bit | Yes |
Source: Intel.com
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