SPECIFICATIONS
| Essentials | |
Status | Launched |
Launch Date | Q3'09 |
Processor Number | i7-870 |
# of Cores | 4 |
# of Threads | 8 |
Clock Speed | 2.93 GHz |
Max Turbo Frequency | 3.6 GHz |
Intel® Smart Cache | 8 MB |
Bus/Core Ratio | 22 |
DMI | 2.5 GT/s |
Instruction Set | 64-bit |
Instruction Set Extensions | SSE4.2 |
Embedded Options Available | No |
Lithography | 45 nm |
Max TDP | 95 W |
VID Voltage Range | 0.6500V-1.4000V |
Tray 1ku Budgetary Price | $294.00 |
| Memory Specifications | |
Max Memory Size (dependent on memory type) | 16 GB |
Memory Types | DDR3-1066/1333 |
# of Memory Channels | 2 |
Max Memory Bandwidth | 21 GB/s |
Physical Address Extensions | 36-bit |
ECC Memory Supported | No |
| Graphics Specifications | |
Integrated Graphics | No |
| Expansion Options | |
PCI Express Revision | 2.0 |
PCI Express Configurations | 1x16, 2x8 |
# of PCI Express Ports | 1 |
| Package Specifications | |
Max CPU Configuration | 1 |
TCASE | 72.7°C |
Package Size | 37.5mm x 37.5mm |
Processing Die Size | 296 mm2 |
# of Processing Die Transistors | 774 million |
Sockets Supported | LGA1156 |
Halogen Free Options Available | Yes |
| Advanced Technologies | |
Intel® Turbo Boost Technology | Yes |
Intel® Hyper-Threading Technology | Yes |
Intel® Virtualization Technology (VT-x) | Yes |
Intel® Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel® Trusted Execution Technology | Yes |
AES New Instructions | No |
Intel® 64 | Yes |
Idle States | Yes |
Enhanced Intel SpeedStep® Technology | Yes |
Intel® Demand Based Switching | No |
Thermal Monitoring Technologies | No |
Execute Disable Bit | Yes |
Source: Intel.com
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